www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 1 of 5 s pec n o : ? ? s s p p e e c c i i f f i i c c a a t t i i o o n n customer product ? saw filter model no hdf 91 4.5 a f11 prepared checked approved ? d a t e 200 6 - 5 - 11 ??? shoulder electronics limited ?? c ustomer received: c hecked ? approved d ate
saw filter hdf 91 4.5 a f11 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 2 of 5 ?? history record date spec . no . ?? part no . ??? customer no . modify content ? remark
saw filter hdf 91 4.5 a f11 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 3 of 5 1. package dimension unit:mm (f - 11) 2. marking hd f914 .5 a 1. color: bl ack or blue 2. 914 .5 : center frequency(mhz) 3. performance 3.1 application low - loss saw filter of cordless system. center frequency:914 .5 mhz 3.2 maximum rating operation temperature range - 4 0 to + 85 storage temperature range - 40 to +85 dc. permissive voltage 0 v dc. max. maximum input power 5dbm
saw filter hdf 91 4.5 a f11 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 4 of 5 3.3 electronic characteristics part number f914 .5 a unit center frequency fo 914 .5 mhz insertion loss: fo1.0 mhz fo - 20~23mhz fo - 40~45mhz fo + 20~23mhz fo + 40~45mhz 4.5max 30.0min 45.0min 20.0min 35.0min db ripple(fo 1.0mhz) 2.0max db input/output impedance 50//10nh //pf 3.4 frequency characteristics 3.5 test circuit
saw filter hdf 91 4.5 a f11 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 5 of 5 4. environmental characteristics 4 - 1 high temperature exposure s ubject the device to +85 for 16 hours. then release the filter into the room conditions for 24 hours prior to the measurement. it shall fulfill the specifications in 3.3 . 4 - 2 low temperature exposure subject the device to - 4 0 for 16 hours. then releas e the device into the room conditions for 24 hours prior to the measurement. it shall fulfill the specifications in 3.3 . . 4 - 3 temperature cycling subject the device to a low temperature of - 40 for 30 minutes. following by a high temperature of +8 5 for 30 minutes. then release the device into the room conditions for 24 hours prior to the me a surement. it shall meet the specifications in 3.3 . . 4 - 4 resistance to solder heat dip the device terminals no closer than 1.5mm into the solder bath at 260 10 f or 10 1 sec. then release the device into the room conditions for 4 hours. the device shall meet the specifications in 3.3 . . 4 - 5 solderability subject the device terminals into the solder bath at 245 5 for 5s, more than 95% area of the terminals mus t be covered with new solder. it shall meet the specifications in 3.3 . . 4 - 6 mechanical shock drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in 3.3 . . 4 - 7 vibration subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 hz. the device shall fulfill the spe cifications in 3.3 . . 5. remark 5.1 static voltage static voltage between signal load & ground may caus e deterioration &destruction of the component. please avoid static voltage. 5.2 ultrasonic cleaning ultrasonic vibration may cause deteri oration & destruction of the component. please avoid ultrasonic cleaning 5.3 soldering only leads of compon ent may be soldered. please avoid soldering another part of component.
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